Zimeng Technology invites you to participate2025 Precision Grinding and Polishing Materials and Processing Technology Development Forum

<Zimeng Technology>

2025year7moon24-25Held at Sheraton Dongguan Hotel2025The 3rd National Forum on the Development of Precision Grinding and Polishing Materials and Processing TechnologiesThis forum will invite upstream and downstream enterprises in the industry chain, research institutes, and industry investment institutions to focus onAbrasive preparation technology, process innovation, polishing equipment research and industrial application for precision grinding and polishingConduct specialized exchanges in various aspects to contribute to the advancement of precision manufacturing in China.

With the continuous development and upgrading of industries such as semiconductor integrated circuits, medical devices, and aerospace, the requirements for surface roughness and shape accuracy of core precision components have reached sub nanometer or even atomic levels. Precision grinding and polishing are the core post-processing processes that affect the reliability and accuracy of precision parts. Precision grinding and polishing technology is undergoing comprehensive innovation from material research and development to process innovation.

Due to the large abrasive particles causing scratches on the surface of the wafer, the overall quality may decrease,CMPPolishing solution requires minimizing the number of large particles as much as possible. For Zimeng Technology, this exchange meeting is a showcaseHow to detectCMPLarge particles in polishing solutionA great opportunity.

At the meeting, Zimeng Technology will also provide for everyoneLPCLarge particle counting systemCMPFlattening particle size and shape analysis technology, precise customized semiconductor large particle solutions.

Ø LPCLarge particle counting analyzer/ZM-02

Product Introduction

The large particle counting analyzer adoptsPhotoresist methodPrinciples of Design and Productionparticle counterIts main function is to be used fortestCMP SlurryNumber of particles in the medicine solutionSuch as silicon dioxide, cerium oxide, aluminum oxide and other chemical solutions.ZM-02Check the quantity of particles in any channel according to the requirements of the product, such as1μmThe2μmThe5μmWait.

Technical features:

u Detection method:Offline or online

u Data channel:1024 pieces

u Custom channel:64 of them

u The upper limit of data concentration can reach1x 10

u Wide detection range,0.5μm - 400μm

u Modular design, easy to upgrade and maintain

u Fully automatic injection, automatic dilution, automatic detection, automatic cleaning, data analysis

For samples with high viscosity,Large particle counting analyzerZM-02It can achieve one click operation to quickly identify high-risk large particles in the slurry, without the need for manual dilution operation, reducing measurement errors and eliminating the need for manual cleaning, greatly improving detection efficiency.

Ø CMP Particle Shape Analyzer/M3000

Product Introduction

Particle shape analyzer is a particle counter designed and produced based on the principle of dynamic image method. Its main function is totestCMP SlurryThe number and shape of particles in the medicinal solution, as well as the concentration of particles with different shapesSuch as silicon dioxide, cerium oxide, aluminum oxide and other chemical solutions.

Different shapes of particles have significant differences in polishing effect and yield, and the control of particle shape isSlurryImportant parameters that need to be controlled in the production process.

Technical features:

u Detection method:Offline or online

u Fully automatic dilution, no need for manual dilution

u forCMP SlurryMedium particle concentration detection

u The upper limit of data concentration can reach1x 109 /ml

Sphericity data

Dundu Data

Particle shape analyzerM3000 YouIt is applicable toCMPThe control of parameters such as "sphericity" and "bluntness" by polishing liquid production enterprises can directly observe the shape and size of the slurry, effectively adjust the production process, and improve product quality and production efficiency. In the future field of precision grinding and polishing, particle shape analyzerM3000It is expected to help enterprises occupy a more advantageous position in the market.

Conclusion

Zimeng Technology has established a comprehensive after-sales service system to provide customers with multi-faceted support. Whether it is the installation and debugging of instruments, operation training, or subsequent maintenance and technical upgrades, there is a professional team that responds and handles them in a timely manner, providing semiconductor enterprises withPrecision customized semiconductor large particle solution.