Ceramic substrate precision laser cutting machine

NegotiableUpdate on 03/29

Model

Nature of the Manufacturer: Producers

Product Category

Place of Origin

Online Consult

Overview

Sea laser cutting of ceramics or drilling holes uses a 200-500W continuous fiber laser for optical shaping and focusing, forming a high-energy density laser beam with a linewidth of only 40um at the focal point. The instantaneous peak power can reach several tens of kilowatts, locally irradiating the surface of ceramic substrates or metal sheets, causing the material to quickly vaporize and peel off in a very short time, thus achieving the purpose of cutting and drilling by removing the material.

Product Details

Product Introduction
Sea radiumLaser cutting of ceramics or drilling is the process of using a 200-500W continuous fiber laser to form a high-energy density laser beam with a linewidth of only 40um at the focal point through optical shaping and focusing. The instantaneous peak power can reach several tens of kilowatts, and the surface of the ceramic substrate or metal sheet is locally irradiated, causing the material to quickly vaporize and peel off in a very short time, thereby achieving the purpose of cutting and drilling by removing the material.

This machine is independently developed by Hai Lei Laser and has the following advantages:

1. The PCB ceramic substrate micro cutting and drilling system adopts self-developed control software for sea laser and multi axis laser control software. The powerful software functions can import formats such as DXF, DWG, PLT, etc. The software can achieve ① real-time and instantaneous adjustment and control of laser energy, optional X and Y linear motor precision motion platform precision motion and grating ruler real-time detection and compensation, ② optional CCD visual automatic positioning function, convenient for product external dimension positioning during precision cutting.
2. PCB is derived from the sea radium laser ultra fast precision laser microfabrication platform system, which has been validated by long-term precision requirements in the market. It is equipped with an imported linear motor motion platform, with an effective stroke of 600 * 600mm, a repeatability of ± 1um, a positioning accuracy of 3um, a high-precision dedicated vacuum suction table, equipped with a 200-500W fiber laser or CO2 laser, and a Z-axis effective stroke of 150mm. It can cut and drill holes on ceramic substrates or thin metal sheets with a thickness of 3mm or less, with a minimum aperture of 100um.

application area

Applicable materials:
Aluminum oxide, aluminum nitride, zirconium oxide, beryllium oxide, silicon nitride, silicon carbide, and all metal materials with a thickness of less than 3mm.

Applicable industries:
High end ceramic substrate PCB circuit shape cutting, through-hole, blind hole drilling, LED ceramic substrate drilling, cutting; High temperature and wear-resistant automotive electrical circuit boards, precision ceramic gears and exterior components cutting, as well as precision metal gears and structural components cutting and drilling.

performance parameter

Technical Parameter	specifications
laser device	1070nm or 10.64um optional
Maximum laser power	200-500W optional
Maximum working range of laser processing	600mm × 600mm arbitrary automatic splicing drilling and cutting
Minimum laser spot size	40um
Laser processing line splicing accuracy	≤±3um
Laser processing speed	0-200mm/S adjustable
Maximum moving speed of XY platform	≤ 500mm/S 1G acceleration
CCD positioning accuracy	≤±2um
XY platform repeatability accuracy	≤±1um
XY platform positioning accuracy	≤3um
Whole machine power supply	5kw／AC220V／50Hz
Cooling method	forced air cooling
Dimensions	1600×1400×1800mm