FD-150 Horizontal Thinning Machine

Main purpose:

Very suitable for products with high workpiece hardness, ultra-thin thickness, and high machining accuracy requirements. For example, rapid thinning of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, ceramic wafers, tungsten steel wafers, etc.

working principle:

1. This series of horizontal grinding machines is a precision grinding equipment, which uses a vacuum spindle to adsorb the workpiece and a diamond grinding wheel for high-speed grinding in the opposite direction, with the diamond grinding wheel swinging back and forth. This method has low grinding resistance, no damage to the workpiece, and uniform grinding with high production efficiency.

Characteristics:

1. It can reduce the processing thickness of the workpiece to 0.02mm without breaking. Moreover, the parallelism and flatness can be controlled within a range of ± 0.001mm.

2. High thinning efficiency, LED sapphire substrate can be thinned by 48um per minute. Silicon wafer can be thinned by 250um per minute.

3. The series of grinding machines adopts a CNC program control system and a touch screen operation panel

Technical parameters: