FD-610LP flat polishing machine

FD-610LP single plane polishing machine

Main purpose:

Widely used for single-sided grinding and polishing of various materials such as LED sapphire substrates, optical glass chips, quartz chips, ceramics, silicon wafers, wafers, molds, light guide plates, stainless steel, and optical connectors.

working principle:

This oneFlat polishing machineFor precision grinding and polishing equipment, the material to be ground and polished is placed on a grinding disc. The grinding disc rotates counterclockwise, and the correction wheel drives the workpiece to rotate on its own. The workpiece is pressurized by gravity, and the workpiece and the grinding disc rotate and rub against each other to achieve the purpose of grinding and polishing.

characteristic:

1. Adopting an interval type automatic spraying device, the spraying interval time can be freely set.

2. The workpiece of the polishing machine is pressurized by a cylinder, and the pressure is adjustable; After polishing, the surface of the workpiece has high brightness, no scratches, no material lines, no pits, no collapsed edges, and high flatness. The surface roughness of the polished workpiece can reach Ra0.0002; The flatness can be controlled within a range of ± 0.002mm.

3. The polishing machine adopts a PLC program control system, a touch screen operation panel, and the grinding disc speed and timing can be directly input on the touch screen.

Technical parameters: