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Dongfang Flash (Beijing) Optoelectronic Technology Co., Ltd
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Dongfang Flash (Beijing) Optoelectronic Technology Co., Ltd

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    Room 1010, Building A, Longyu Center, No.1 Longyu Middle Street, Huilongguan, Changping District, Beijing

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Hamamatsu InGaAs Line Array Scanning Camera C15333-10E04 Solar Cell Defect Inspection Short Wave Infrared

NegotiableUpdate on 03/05
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Overview

SWIR (short wavelength infrared) imaging is an ideal solution for non-destructive testing. It can see things beneath the surface, distinguish materials based on their SWIR spectral characteristics, and provide a safe and convenient way to ensure product quality. Integrating SWIR imaging into the production line requires cameras such as C15333-10E04 InGaAs line array scanning cameras, which have high SWIR sensitivity and fast line speed, making them ideal for real-time, inline non-destructive inspections.

Product Details

SWIR (short wavelength infrared) imaging is an ideal solution for non-destructive testing. It can see things beneath the surface, distinguish materials based on their SWIR spectral characteristics, and provide a safe and convenient way to ensure product quality. Integrating SWIR imaging into the production line requires cameras such as C15333-10E InGaAs line array scanning cameras, which have high SWIR sensitivity and fast line speed, making them ideal for real-time, inline non-destructive inspections.

  characteristic

SWIR sensitivity from 950 nm to 1700 nm

1024 pixel linear array

Maximum line speed: 40 kHz

● Interface: Adopting Gigabit Ethernet

Equipped with high-quality images (background subtraction, real-time shadow correction)

  purpose

Food and agricultural products (damage inspection, quality screening, material identification, etc.)

Semiconductor (silicon wafer pattern inspection, EL/PL solar cell inspection, etc.)

Industrial (moisture content, leak detection, container inspection, etc.)

  detailed parameters

PRODUCT MODEL C15333-10E04
Imaging device

InGaAs linear array sensor

Effective Pixels 1024 (H) × 1 (V)
cell size 12.5 μm (H) × 12.5 μm (V)
Effective area 12.8 mm (H) × 0.0125 mm (V)
Full trap capacity Obtained 0:4.0 electrons, 1:0.76 electrons, 2:0.16 electrons, 3:0.16 electrons
Reading speed

Internal mode: 40 kHz (21 μ s exposure time)

Edge trigger: 20 kHz (21 μ s exposure time)

Synchronous readout: 40 kHz

time of exposure 21 μ s to 1 s (1 μ s step size)
External trigger input

Edge trigger, synchronous readout

External trigger signal routing

SMA or 12 pin HIROSE connector

Image processing function Background subtraction, real-time shadow correction
interface Gigabit Ethernet
A/D converter 14 positions
Lens interface C-type interface
power supply DC 12V
Power consumption Maximum 6 W
operating ambient temperature 0 ℃ to+40 ℃
Storage environment temperature -10 ℃ to+50 ℃
Operating environment humidity 30% to 80%(No fog phenomenon)
Storage environment humidity Up to 90%(No fog phenomenon

  Spectral sensitivity characteristics

  size