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E-mail
ljx@szfangda.com.cn
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Phone
18588205569
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Address
Building 1, Baotang High tech Park, Tangwei Village, Guangming New District, Shenzhen
Product Categories
- Mold Polishing Machine Series
- Ceramic Grinding Machine Series
- Stainless steel polishing machine series
- Thinning machine series
- Mobile phone panel polishing machine series
- Grinding consumables and supporting fixtures
- Flat Grinding Machine Series
- LED Sapphire Substrate Grinding and Polishing Machine
- Flat polishing machine series
Shenzhen Fangda Grinding Technology Co., Ltd
LED Sapphire Substrate Polishing Machine
NegotiableUpdate on 05/22
- Model
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Overview
High precision flat grinding and polishing machine is mainly used for single-sided grinding and polishing of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, various pieces, molds, light guide plates, stainless steel, and optical connectors. Working principle: This grinding machine is a precision grinding and polishing equipment. The material to be ground and polished is placed on the grinding disc, and the grinding disc rotates counterclockwise. The correction wheel drives the workpiece to rotate on its own, and gravity pressure is applied to the workpiece. The workpiece and the grinding disc rotate and rub against each other to achieve the purpose of grinding and polishing
Product Details
High precision flat grinding and polishing machine
Main purpose:
Widely used for single-sided grinding and polishing of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, wafers, molds, light guide plates, stainless steel, and optical connectors
working principle:
This grinding machine is a precision grinding and polishing equipment. The material to be ground and polished is placed on a grinding disc, which rotates counterclockwise. The correction wheel drives the workpiece to rotate on its own, and the workpiece is pressurized by gravity. The workpiece and the grinding disc rotate and rub against each other to achieve the purpose of grinding and polishing.
characteristic:
1. Adopting an interval type automatic spraying device, the spraying interval time can be freely set.
2. The series of grinding machines adopts a method of adding 4 cylinders to the workpiece pressure, and the pressure can be adjusted; After polishing, the surface of the workpiece has high brightness, no scratches, no material lines, no pits, no collapsed edges, and high flatness. The surface roughness of the polished workpiece can reach Ra0.0002; The flatness can be controlled within a range of ± 0.002mm.
3. The series grinding machine adopts a PLC program control system, a touch screen operation panel, and the grinding disc speed and timing can be directly input on the touch screen.
Main purpose:
Widely used for single-sided grinding and polishing of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, wafers, molds, light guide plates, stainless steel, and optical connectors
working principle:
This grinding machine is a precision grinding and polishing equipment. The material to be ground and polished is placed on a grinding disc, which rotates counterclockwise. The correction wheel drives the workpiece to rotate on its own, and the workpiece is pressurized by gravity. The workpiece and the grinding disc rotate and rub against each other to achieve the purpose of grinding and polishing.
characteristic:
1. Adopting an interval type automatic spraying device, the spraying interval time can be freely set.
2. The series of grinding machines adopts a method of adding 4 cylinders to the workpiece pressure, and the pressure can be adjusted; After polishing, the surface of the workpiece has high brightness, no scratches, no material lines, no pits, no collapsed edges, and high flatness. The surface roughness of the polished workpiece can reach Ra0.0002; The flatness can be controlled within a range of ± 0.002mm.
3. The series grinding machine adopts a PLC program control system, a touch screen operation panel, and the grinding disc speed and timing can be directly input on the touch screen.
Technical parameters:
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Model number |
FD-24LX |
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Grinding disc specifications |
φ610×φ180×12t |
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Maximum workpiece size |
φ240mm |
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Ceramic correction wheel specifications |
Three pieces of diameter 280 × 240mm |
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Grinding disc speed |
0~110rpm |
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Timing range |
99 minutes and 59 seconds |
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Main motor power |
3.7KW.380V3 phase |
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External dimensions(mm) |
1050×1200×1700 |
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Weight: |
1200kg |
