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E-mail
ljx@szfangda.com.cn
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Phone
18588205569
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Address
Building 1, Baotang High tech Park, Tangwei Village, Guangming New District, Shenzhen
Product Categories
- Mold Polishing Machine Series
- Ceramic Grinding Machine Series
- Stainless steel polishing machine series
- Thinning machine series
- Mobile phone panel polishing machine series
- Grinding consumables and supporting fixtures
- Flat Grinding Machine Series
- LED Sapphire Substrate Grinding and Polishing Machine
- Flat polishing machine series
Shenzhen Fangda Grinding Technology Co., Ltd
LED Sapphire Substrate Thinning Machine
NegotiableUpdate on 05/22
- Model
- Nature of the Manufacturer
- Producers
- Product Category
- Place of Origin
Overview
High speed transverse thinning machine is mainly used for products with high workpiece hardness, ultra-thin thickness, and high processing accuracy requirements
Product Details
High speed transverse thinning machine
Main purpose:
Very suitable for products with high workpiece hardness, ultra-thin thickness, and high machining accuracy requirements. For example, rapid thinning of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, ceramic wafers, tungsten steel wafers, etc.
working principle:
1. This series of horizontal grinding machines is a precision grinding equipment, which uses a vacuum spindle to adsorb the workpiece and a diamond grinding wheel for high-speed grinding in the opposite direction, with the diamond grinding wheel swinging back and forth. This method has low grinding resistance, no damage to the workpiece, and uniform grinding with high production efficiency.
Characteristics:
1. It can reduce the processing thickness of the workpiece to 0.02mm without breaking. Moreover, the parallelism and flatness can be controlled within a range of ± 0.002mm.
2. High thinning efficiency, LED sapphire substrate can be thinned by 48um per minute. Silicon wafer can be thinned by 250um per minute.
3. The series of grinding machines adopts a CNC program control system and a touch screen operation panel,
Technical parameters:
Main purpose:
Very suitable for products with high workpiece hardness, ultra-thin thickness, and high machining accuracy requirements. For example, rapid thinning of various materials such as LED sapphire substrates, optical glass chips, quartz chips, silicon wafers, ceramic wafers, tungsten steel wafers, etc.
working principle:
1. This series of horizontal grinding machines is a precision grinding equipment, which uses a vacuum spindle to adsorb the workpiece and a diamond grinding wheel for high-speed grinding in the opposite direction, with the diamond grinding wheel swinging back and forth. This method has low grinding resistance, no damage to the workpiece, and uniform grinding with high production efficiency.
Characteristics:
1. It can reduce the processing thickness of the workpiece to 0.02mm without breaking. Moreover, the parallelism and flatness can be controlled within a range of ± 0.002mm.
2. High thinning efficiency, LED sapphire substrate can be thinned by 48um per minute. Silicon wafer can be thinned by 250um per minute.
3. The series of grinding machines adopts a CNC program control system and a touch screen operation panel,
Technical parameters:
|
Model number |
FD-150LX |
FD-180LX |
FD-200LX |
FD-230LX |
|
Diamond grinding wheel size |
φ150×H25 |
φ180×H25 |
φ200×H30 |
φ230×H30 |
|
Maximum workpiece size |
φ150mm |
φ180mm |
φ200mm |
φ230mm |
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Grinding wheel speed (adjustable) |
0---1000rpm /minute |
0---1000rpm /minute |
0---800rpm /minute |
0---800rpm /minute |
|
Workpiece speed (adjustable) |
0---2000rpm /minute |
0---2000rpm /minute |
0---1800rpm /minute |
0---1800rpm /minute |
|
Grinding wheel motor power |
1.5KW. 380V 3each other |
1.5KW. 380V3each other |
2.2KW. 380V 3each other |
2.2KW. 380V 3each other |
|
Power of vacuum spindle motor |
0.75KW. 380V3each other |
0.75KW. 380V3each other |
1.1KW. 380V3each other |
1.1KW. 380V3each other |
|
Control accuracy (parallelism) |
1um（φ100mm） |
1um（φ100mm） |
1um（φ100mm） |
1um（φ100mm） |
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External dimensions |
1200×550×1550 |
1200×550×1550 |
1350×600×1600 |
1350×600×1600 |
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Weight: |
850kg |
980kg |
1100kg |
1300kg |
