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E-mail
ec@hkaco.com
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Phone
13412598543
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Address
Building T6, PCI Future Community, No. 30 Kaitai Avenue, Huangpu District, Guangzhou City
Product Categories
Guangzhou Hongke Electronic Technology Co., Ltd
MEPS-TBC-WL 3D Organ Chip
NegotiableUpdate on 02/20
- Model
- Nature of the Manufacturer
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- Place of Origin
Overview
2D-3D mixed tissue barrier modeling $r $n loads multiple cells and matrices to reproduce complex three-dimensional human tissue structures $r $n is suitable for physiological shear stress analysis of upper channels $r $n only by diffusing to the sampling plate for high-precision barrier transmission analysis $r $n is suitable for automatic microphysiological systems (ProMEPS)
Product Details
MEPS-TBC-WL
3D organ chip (bottom hole type)
2D-3D mixed tissue barrier modeling
Loading multiple cells and matrices to reproduce complex three-dimensional human tissue structures
Physiological shear stress applicable to the upper channel
High precision barrier transmission analysis is conducted solely through diffusion to the sample plate
Suitable for automatic microphysiological systems (ProMEPS) ™)
Chip parameters
application
Infusion based 2D/3D tissue tissue co culture
The number of units per chip
8
material
polystyrene
size
25 mm X 75 mm
foundation
Channel width X height
ECM gel pore volume
1000 μm X 3000 μm
2~14.35 μL
film
Aperture/density
material
thickness
Co cultivation interface surface
3 μm / 6E+05 cm2
polyester fiber
9 μm
1.14 mm2
insert
Channel width X height
Volume of infusion channel
500 μm X 100 μm
0.3 μL
Sample collection
Board width X board height
volume
900 μm X 2900 μm
50 μ L per board
perfusion
No pump, gravity drive, capillary force
application
MEPS-BBB
3D blood-brain barrier
MEPS-NVU
3D neurovascular unit
MEPS-HFU
3D liver function unit
MEPS-STL
3D skin tissue layer
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