PTL-VM500 Vacuum Plasma Surface Treatment System

The low-temperature plasma surface treatment equipment consists of a vacuum chamber, a high-frequency plasma power supply, a vacuum pumping system, an inflation system, an automatic control system, and other components Cheng. The basic principle of operation is that under vacuum conditions, plasma can ionize gases through controlled and qualitative methodsUsing a vacuum pump to evacuate the working chamber to a vacuum degree of 30-40 Pa, and then ionizing the gas under the action of a high-frequency generator to form plasma (the fourth state of matter), its significant feature is high uniformity glow discharge, which emits colored visible light from blue to deep purple according to different gases, and the material processing temperature is close to room temperature. These highly active particles interact with the treated surface, resulting in various surface modifications such as hydrophilicity, water repellency, low friction, high cleanliness, activation, etching, etc.

Technical Parameter

1Equipment external dimensions: 450mm*400mm*240mm

2Vacuum chamber size: Φ151×300(L)mm （5L）

3Warehouse structureStainless steel chamber, built-in capacitive coupling electrode, pollution-free, built-in quartz tray.

4Plasma GeneratorRF, power adjustable from 0-300W, full circuit protection, continuous long-term operation (air-cooled).

5control systemPLC touch screen fully automatic control, using imported brand electrical components such as Omron and Schneider, with manual and automatic control modes. True Color Delta touch screen, Siemens programmable logic controller (PLC), American made vacuum pressure sensing system, can set, modify, monitor process parameters such as vacuum pressure, processing time, plasma power online, and has multiple functions such as fault alarm and process storage. Set various process parameters in automatic mode to start with one click and run continuously and repeatedly. Manual mode is used for experimental processes and equipment maintenance and repair.

technological process:

1Process flow Load the workpiece→ Vacuumize → Inject reaction gas → Plasma discharge treatment → Backflush gas → Remove workpiece

2Process control:

2.1 Processing time control: continuously adjustable from 1 second to 120 minutes.

2.2 Plasma discharge pressure: 30-50Pa.

2.3 Power setting range: continuously adjustable from 0 to 300W.

2.4 Flow setting range: Gas 1 (0-300ml/min) Gas 2 (0-500ml/min).

PLC software functions (control interface)

Main screen: Real time monitoring and display of operating status and data, plasma power supply power, gas flow rate, valve switches, vacuum pressure, etc Running time, etc.

Parameter setting: Process parameters and steps can be set and modified.

Working status: You can view data and status such as vacuum pressure and plasma power online.

Fault alarm: multiple fault detection, alarm and interlock protection .

PDMS chip bonding application

PDMS and glass slide bonding effect

After bonding, a peeling experiment was conducted,Even after tearing, PDMS cannot be separated from the glass slide, indicating that the strength of the bonding layer is much higher than that of PDMS itself. This system has a simple manufacturing process, high yield, fast bonding speed, high strength, and no leakage phenomenon.