Tempfix ™ Conductive installation adhesive

This product is particularly suitable for bonding powders, pollen, crystals, and critical point drying biomaterials.Tempfix™Conductive installation adhesive is a thermoplastic and conductive bonding resin that does not contain solvent based substances. When used to install powder and small particle samples, do not worry about small particles“deposition”Into the adhesive.TempfixNot sticky at room temperature40°CIt has viscosity and its melting point is120°CThis product can also be used as an embedding medium. In addition,TempfixConductive installation adhesive is also suitable forAFMThe sample installation of the atomic force microscope (AFM) requires special caution when using this product to install AFM samples.

each setTempfixProducts include:

A)twoTempfixAdhesive stick,1.5gAdhesive;

B)The side length is10 mmof4An aluminum block;

C)A sample holder with a single clamping screw.

Product Information