Main application industries and case studies

1. Consumer electronics and semiconductor packaging are one of the widely used and demanding fields.

Case: Underfill of mobile phone chips

Process requirements: Accurately inject epoxy resin adhesive into the bottom of BGA chips, covering and without bubbles. Excessive adhesive will contaminate the surrounding area, while insufficient filling will affect reliability.

Weighing application: Weigh the empty board before dispensing (peel off), and weigh it again after dispensing is completed. The system calculates the actual dispensing amount in real-time and compares it with the set value. If it is within the tolerance range (such as setting 500mg, tolerance ± 10mg), it will flow to the next process; If it exceeds the range, immediately sound the alarm or sort it to the repair line. Domestic brands such as Axis Automation and Anda Intelligence have mature solutions in this field.

Case: Glue dispensing for mobile phone/headphone speaker (speaker)

Process requirements: Apply sealant at the edge of the speaker, ensuring a uniform adhesive line and a constant amount, which directly affects the airtightness and sound quality of the sound chamber.

Weighing application: Weigh each horn module before and after dispensing to ensure consistent adhesive usage for each product. By using Statistical Process Control (SPC) charts, changes in adhesive viscosity or performance degradation trends of dispensing valves can be detected in advance for preventive maintenance.

Case: Semiconductor LED packaging patch adhesive/fluorescent adhesive dot coating

Process requirements: When fixing or spot coating fluorescent powder adhesive on LED chips, the adhesive dot volume should be small and the consistency requirement should be high.

Weighing application: Using a high-resolution (0.1mg level) weighing module, batch weighing of the entire plate (such as 100 pieces) of products is carried out, calculating the average amount of glue per piece for rapid calibration and batch quality control.