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- Fully automatic laser wafer marking machine
- High precision marking and etching equipment
- Laser equipment accessories
- Laser automation
- Fully automatic UV laser etching machine
- Nanosecond laser cutting equipment
- High precision laser cutting equipment
- Femtosecond laser cutting machine
- High precision laser marking machine
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- High precision laser drilling equipment
- Femtosecond laser cutting equipment
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Shenzhen Yunteng Laser Technology Co., Ltd
Fingerprint module chip camera cutting machine
NegotiableUpdate on 03/16
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Overview
Fingerprint module chip camera cutting machine
Product Details
Welcome to personalized customization
A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.
Welcome to free sampling
Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!
Welcome to visit in person
Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.
Industry Applications：
1. Fingerprint recognition chip cutting, camera cutting.
2. FPC soft board cutting and drilling.
3. PCB circuit board slicing and cutting.
Advantages of the machine:
1. Using nanosecond ultraviolet laser and cold light source, the laser cutting heat affected zone is particularly small as 10 μ m
2. The minimum focused spot can reach 10 μ m, suitable for micro cutting and drilling of any organic and inorganic material.
3. CCD visual pre scanning&automatic target positioning, maximum processing range of 500mm × 350mm, XY platform splicing accuracy of ≤± 5 μ m
4. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.
5. The robot automatically loads and unloads materials, cuts IC fingerprint recognition chips, and takes 3 seconds per chip.
6. 6 years of research and design technology accumulation in laser microfabrication systems, stable performance, and no consumables.
Technical specifications and parameters
| serial number | project | Technical Specifications |
| Optical unit | ||
| 1 | Laser type | 355nm |
| 2 | cooling method | Constant temperature water cooling |
| 3 | laser power | 15W |
| 4 | Beam quality | M²<1.3 |
| 5 | Focusing method&Number of processing heads | Flat field focusing lens, single or double head optional |
| 6 | Minimum focused spot diameter | F10Mm |
| Laser processing performance | ||
| 7 | processing speed | Adjustable from 100 to 1500mm/s |
| 8 | Minimum collapse edge | 10Mm |
| 9 | Maximum processing material thickness | 1mm |
| 10 | Maximum processing size&Accuracy | 500mm×350mm, ±5μm |
| Mechanical unit | ||
| 11 | Machine tool structure | gantry type |
| 12 | Number of machine tool motion axes&Types | most8轴, X，Y, Z, & Θ 轴 |
| 13 | Maximum itinerary on the platform&Speed | 500mm×350mm,800mm/s |
| 14 | Repetitive accuracy of motion platform | ≤±1μm |
| 15 | Positioning accuracy of sports platform | ≤±3μm |
| Software control unit | ||
| 16 | Laser processing&Platform control | Strongsoft, Strongsmart |
| 17 | Processing file import format | Dxf, Plt, DWG, Gebar |
| 18 | CCDVisual positioning software | AISYS Vision |
| 19 | CCDVisual positioning accuracy | ≤±3μm |
| Electrical unit | ||
| 20 | PLC controller | Panasonic |
| 21 | vacuum system | vacuum generator |
| 22 | dust removal&Dust collection system | Centrifugal fan |
| Automation unit | ||
| 23 | Automatic loading and unloading system | XZAxis+movable loading and unloading platform |
| Advanced optional units | ||
| 24 | AOI Visual Inspection | 60Grain/min |
| 25 | Automatic cleaning and sorting | 60Grain/min |
| Installation environment | ||
| 26 | Whole machine power supply&voltage regulator power | 220V380V,5KW |
| 27 | Compressed air pressure | ≥0.6MPa |
| 28 | Cleanroom level | 10000 |
| 29 | Ground bearing capacity | 1.5T/m² |
Cutting samples:
Why choose Yunteng Laser:
First class R&D team
85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.
Rich industry experience
Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.
Integrated solution
The company has always adhered to the market-oriented approach and taken it as its responsibility to meet the actual needs of customers. Over the years, the company has independently developed and completed industry benchmark projects such as TP silver paste line+ITO automatic positioning etching system for touch screen industry, FPC+PCB high-precision automatic feeding and cutting system, laying a solid foundation for future development!
Internal Design Drawing (Reference):
Focusing on professional cooperation and mutual benefit has been our driving force for many years!
Free solution design
Free sample evaluation
Free quotation consultation
Free trial of standard machines
Please consult relevant business personnel for details.
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