Fully automatic wafer cutting machine picosecond laser

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Industry applications:

Semiconductor integrated circuits, including single and double table glass passivated diode wafer cutting and scribing, single and double table thyristor wafer cutting and scribing, gallium arsenide, gallium nitride, and IC wafer cutting and scribing.

Advantages of the machine:

1. Using picosecond laser and customized focusing head, the focused beam diameter is as small as 3Mm， Cutting only requires 10Mm， Narrow cutting seam, higher chip output rate, no thermal effect, and no damage to chip circuits.

2. The cutting speed can reach up to 500mm/s, and for samples with a thickness of 1mm or less, laser marking can be broken in just one go.

3. CCD visual pre scanning&automatic target positioning, maximum processing range 650mm × 450mm, XY platform splicing accuracy ≤± 3 μ m

4. No taper cutting, minimum edge breakage 3Mm, Smooth edges.

5. Support multiple visual positioning features, such as cross, solid circle, hollow circle, L-shaped right angle edge, image feature points, etc.

6. 6 years of research and design technology accumulation in laser microfabrication systems, stable performance, and 30000 hours without consumables.

7. The fully automatic loading and unloading system of the robotic arm saves labor costs.

Picosecond laser cutting principle (focusing and bursting cutting inside transparent materials):

By using Bessel or DOE optical systems, Gaussian laser beams are compressed to the diffraction limit. Under the action of laser beams with high repetition rates of 100-200KHz and extremely short pulse widths of 10ps, the focused spot diameter is reduced to as small as 3Mm， It has a very high peak power density, and when it is focused inside the transparent material, it instantly vaporizes the material in that area, creating a vaporization zone that spreads to the upper and lower surfaces to form nonlinear cracks, thereby achieving cutting and separation of the material. Common transparent materials include glass, sapphire, and semiconductor silicon wafers (infrared radiation can penetrate semiconductor silicon materials), all of which are suitable for picosecond and femtosecond laser cutting processing.

Technical specifications and parameters

Wafer cutting effect image: