Micro focus X-ray detection system

Micro focus X-ray detection system

This system is a high-tech product that integrates modern computer software technology, precision mechanical manufacturing technology, optical technology, electronic technology, sensor technology, non-destructive testing technology, and image processing technology. It is an effective means of conducting product research, failure analysis, highly reliable screening, quality evaluation, process improvement, and other related work.

scope of application

● Suitable for testing BGA, CSP, Flip chip

PCB board welding condition inspection

● Various battery testing

● IC packaging inspection

● Components such as capacitors and resistors

Internal defects of metal materials and dielectric materials

Internal structure and components of lightweight materials

Electric heating tubes, pearls, precision components, etc

Main functions of image processing system

Virtual 3D imaging, real-time zooming in and out;

Grayscale optimization, real-time pseudo color, user-friendly design;

Electronic filming, multi frame overlay, fast and convenient;

● Supports positive/negative images, with edge enhancement;

Accurate curvature measurement and statistics;

Advanced measuring tools;

BGA solder ball measurement technology;

● Can measure angles, radii, solder joint areas, and bubble areas; Calculation of the proportion of bubbles; Coordinate positioning and statistics of solder joints;

● Dynamic storage; Multiple output methods including storage, printing, DVD reading and writing.

Parameters

● Micro focus X-ray source

● Voltage regulation range: 20-160kV

● Tube current regulation range: 0.1 μ A~1000 μ A

● Focus size: 1 μ m, 5 μ m, 30 μ m

JIMA resolution: 0.5 μ m~2 μ m

Magnification factor: 20x~3000x

The detection platform can move along multiple axes of X-Y-Z

Detecting instances