The semiconductor ultrapure water equipment adopts pre-treatment, reverse osmosis system, EDI system, and polishing mixed bed system to almost remove the conductive medium in the water, and also remove the undissociated colloidal substances, gases, and organic substances in the water to a very low degree.
Product Introduction:
Semiconductor ultrapure water equipmentA water treatment equipment that uses pre-treatment, reverse osmosis system, EDI system, and polishing mixed bed system to almost remove conductive media from water, and also removes non dissociative colloidal substances, gases, and organic matter from water to a very low level.
The desalination core component of ultra pure water system equipment is the reverse osmosis membrane module. Ultra pure water system equipment usually consists of a pretreatment section, a reverse osmosis host section, an EDI system, and a post-treatment section
Working principle of EDI:
1. Resin intercepts dissolved ions in water.
2. Under the action of the electrode, the trapped ions move towards the positive electrode, while the anions move towards the negative electrode.
3. Cations pass through the cation membrane and are expelled from the resin/membrane.
4. Anions pass through the anion membrane and are expelled from the resin/membrane.
5. The concentrated ions are discharged from the wastewater flow path.
6. Deionized water flows out from the resin/membrane.
Semiconductor ultrapure water equipmentProduct Features:
1. High degree of automation, with automatic protection function.
2. The membrane module is made of composite membrane rolls and exhibits higher solute separation and permeation rates.
3. Low energy consumption, high water utilization efficiency, and low operating costs.
4. Reasonable structure and small footprint.
5. The system has no vulnerable components and does not require extensive maintenance.
Main purpose:
1. Production and cleaning of ultra pure materials and reagents.
2. Production and cleaning of electronic products.
3. Production of battery products.
4. Production and cleaning of semiconductor products.
5. Production and cleaning of circuit boards.
6. Production of other high-tech precision products.