Semiconductor wafer laser drilling machine

NegotiableUpdate on 03/16

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Nature of the Manufacturer: Producers

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Overview

Semiconductor wafer laser drilling machine

Product Details

Welcome to personalized customization

A professional customization team can provide personalized customization services according to the needs of customers. If you have such needs, please feel free to consult the customer service hotline: 13751030658.

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Yunteng Laser can provide free sampling services. For technical consultation, process consultation, product consultation, and transportation consultation, please call directly!

Welcome to visit in person
Yunteng Laser's product quality is industry-leading. Welcome to visit and inspect the company on site! Multiple companies designated laser brands and witnessed together.

1. This device uses an IPG laser, which has stable power, long lifespan, and is maintenance free

2. Large hole depth ratio and good roundness of micropores

3. Fixed optical path, movable platform, good consistency of hole pattern, and good verticality

4. Synchronized motion drilling, fast speed

5. Automatic hole placement, adjustable hole spacing, accurate drilling

6. Guide in DXF, PLT and other graphics, drill holes according to the graphic requirements

7. Adopting dual closed-loop position control with high accuracy

8. Vacuum adsorption, easy to operate

9. Vacuum cleaning treatment, equipment can be placed in the ultra clean room

Related applications:

Applied to materials such as silicon chips, semiconductor wafers, amorphous films, etc

Technical specifications and parameters:

Serial Number	project	Technical Parameter
Optical unit
1	Laser type	355, 532, 1064nm available in 10ps
2	Cooling method	Constant temperature water cooling
3	laser power	10~100W
4	Beam Quality	M²<1.3
5	Focusing method&number of processing heads	Single point&flat field focusing lens, dual head
6	Minimum focused spot diameter	Ф3--15μm
Laser processing performance
7	Processing speed	100~3000mm/s adjustable
8	Minimum collapse edge	3μm
9	Maximum processing material thickness	2mm
10	Maximum machining size&accuracy	12inches, ±5μm
Mechanical unit
11	machine tool structure	Gantry
12	Number and types of machine tool motion axes	Up to 8 axes, X, Y, Z,&θ axes
13	Maximum platform travel and speed	650mm×450mm，800mm/s
14	Repetitive accuracy of motion platform	≤±1μm
15	Positioning accuracy of sports platform	≤±3μm
Software control unit
16	Laser Processing&Platform Control	Strongsoft, Strongsmart
17	Processing file import format	Dxf, Plt, DWG, Gebar
18	CCD visual positioning software	AISYS Vision
19	CCD visual positioning accuracy	≤±3μm
Electrical unit
20	plc controller	Panasonic
21	vacuum system	vacuum pump
22	Dust removal&collection system	Professional dust filtration integrated purification machine
Automation unit
23	Automatic loading and unloading system	XZ axis+movable loading and unloading platform
Advanced optional units
24	AOI Visual Inspection	8-12 inch large sheet/3 minutes
25	Automatic fragmentation function	8-12 inch large sheet/3 minutes
26	Automatic cleaning and sorting	8-12 inch large sheet/3 minutes
Installation environment
27	Whole machine power supply&voltage regulator power	220V380V,8KW
28	compressed air pressure	≥0.6MPa
29	Cleanroom level	10000
30	Ground bearing capacity	2T/m²
31	Protect nitrogen gas	High purity nitrogen

Cutting and drilling samples:

Why choose Yunteng LaserWhy choose rhythm laser

First class R&D team

85% of the company's employees have a college degree or above, and more than half of the total number of technical R&D personnel, among which R&D backbone personnel represent the top level in the industry.

Rich industry experience

Since its establishment in 2013, the company has gone through ups and downs, relying on first-class professional technology and strong research and development advantages, successfully providing laser equipment and application services to nearly 300 enterprises in different industries, and accumulating rich industry experience.

Integrated solution

The company always adheres to the market-oriented approach and takes it as its responsibility to solve the actual needs of customers.

Developed TP silver paste line+ITO automatic positioning etching system solution for touch screen industry, FPC+PCB high-precision

Automatic feeding and cutting system.

Focusing on professional cooperation and mutual benefit has been our driving force for many years!

Free solution design

Free sample evaluation

Free quotation consultation

Free trial of standard machines

Please consult relevant business personnel for details.