Chemical laboratory refrigeration machine | Non standard customization to accurately match requirements

Chemical laboratory refrigeration machine | Non standard customization to accurately match requirements

Chemical laboratory refrigeration machine | Non standard customization to accurately match requirements

Semiconductor plant chillers need to meet strict temperature stability, rapid heat dissipation, and corrosion resistance requirements in high heat release temperature control applications. The following is an analysis of their core application scenarios and technical points:

1、 Typical applications in high heat release scenarios

1Etching process（Like plasma etching）

The high-frequency electric field generates instantaneous high temperature, and the chiller needs to quickly dissipate heat to maintain stable chamber temperature and avoid fluctuations in etching rate.

2Ion implantation

When high-energy ion beams bombard wafers, concentrated heat is generated. The chiller needs to cool the target disk and beam components to prevent lattice damage and uneven doping.

3Diffusion and oxidation

When the furnace temperature is high, the chiller needs to quickly remove heat to prevent overheating and maintain temperature uniformity, avoiding wafer warping due to thermal stress.

4Chemical mechanical polishing（CMP）

Polishing friction generates high temperatures, which can easily cause the polishing solution to evaporate. The chiller needs to cool the polishing pad and transmission system to reduce surface defects.

5Thin film deposition（CVD/PVD）

The high-temperature gas in the reaction chamber needs to be rapidly cooled to prevent side reactions;Cooling the sputtering target material can extend its lifespan and improve the uniformity of the thin film.

2、 Technical difficulties and solutions for high heat release temperature control

1High precision temperature control

Need to achieve±0.5℃Temperature control accuracy, achieved through multi-stage refrigeration system and dynamicPIDAlgorithm adjustment.

2Rapid cooling ability

In some scenarios, large temperature difference cooling needs to be achieved in a short period of time, and compressors and plate heat exchangers are used to improve cooling efficiency.

3Low vibration and low noise design

The sound insulation cover and shock absorption structure of the compressor can prevent vibration interference with processes such as photolithography.

Intelligence and Energy Efficiency Optimization

Integrate pressure sensors and electromagnetic three-way valves to achieve pipeline pressure reduction and internal circulation switching;Intelligent monitoring system reduces energy consumption.

3、 Key points for selecting chillers

1Matching cooling capacity

Choose a cooling capacity slightly greater than the required amount based on the device's heat dissipation（Like redundant design）To avoid temperature control failure caused by overload or low efficiency.

2Selection of refrigeration method

High power scenario preferred water-cooled type（high efficiency）Due to limited space, air-cooled type is adopted（Flexible but inefficient）.

3Material and process compatibility

Optional isolation and explosion-proof function;

Adopting variable frequency compressors to meet the production standards of semiconductor factories.

The high heat release scenarios in semiconductor factories require strict temperature control accuracy and heat dissipation efficiency for chillers. Guanya constant temperature semiconductor chillers support multi-channel temperature control, covering the entire process from wafer manufacturing to packaging and testing, and require customized selection based on process requirements.