Laboratory chiller | Easy to operate and customizable temperature control solution

Laboratory chiller | Easy to operate and customizable temperature control solution

Laboratory chiller | Easy to operate and customizable temperature control solution

The following is a technical analysis and application points about the use of variable frequency deep cooling machines as a cold source for semiconductor manufacturing processes, combined with industry demand and search data to comprehensively explain:

1、 Core application scenarios in semiconductor manufacturing

1Key processes in wafer manufacturing

Lithography process: requires rapid cooling of the lithography machine light source components（Such as lasers and lenses）To avoid temperature fluctuations causing changes in photoresist viscosity and affecting exposure accuracy. Variable frequency deep cooling machine achieves dynamic adjustment of compressor speed to achieve±0.1℃Temperature control accuracy ensures chip resolution.

2Etching and thin film deposition

Plasma etching andCVD/PVDIn the process, the temperature of the reaction chamber needs to be stable at-40℃~200℃Wide temperature range, variable frequency deep cooling machine through multi-stage refrigeration system（Connecting semiconductor refrigeration chips in series）Quickly dissipate heat, affect side reactions, and improve film uniformity.

3Wafer cleaning and polishing

The temperature of the cleaning solution needs to be accurately controlled to prevent chemical solutions from damaging the wafer surface due to temperature fluctuations;CMPCooling the polishing pad during the process to reduce surface defects caused by frictional heat.

4Packaging and testing process

In the subsequent processes such as chip solidification and annealing, deep cooling machines provide-80℃low-temperature environment（If using ethylene glycol refrigerant）Accelerate the curing process and reduce thermal stress to enhance packaging reliability.

2、 Selection and Operation Points

Cooling capacity matching

Redundancy should be reserved based on the peak heat load of the process, such as the rated heat dissipation of a certain etching equipment50kWSelect and prepare cooling capacity≥60kWThe cryogenic unit.

Environmental adaptability

Cleanroom scene needs to be configuredHEPAfiltration system;Titanium alloy material is preferred for corrosive environments;Select isolated explosion-proof models for explosion-proof requirements.

Due to its wide temperature range, high precision, and intelligent advantages, the selection of variable frequency cryogenic machines requires consideration of process adaptability. You can contact Guanya constant temperature engineers for selection services.