German FISCHER Fischer SR-SCOPE RMP30-S Copper Thickness Gauge

NegotiableUpdate on 02/09

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Overview

The SR-SCOPE RMP30-S copper plate thickness gauge is a portable device that uses the 4-point resistance method and is very suitable for measuring the thickness of thin coatings on multi-layer circuit boards. The multi-layer copper plating on this circuit board is usually separated by insulation such as epoxy resin. The advantage of SR-SCOPE is that it uses the resistance method to measure without being affected by other layers, so it can accurately determine the thickness of the topmost copper layer.

Product Details

product description

FISCHER Fischer SR-SCOPE, Germany ® RMP30-S Copper Thickness Gauge - Measurement of Copper Thickness on Printed Circuit Boards,This portable device adopts the 4-point resistance method, which is very suitable for measuring the thickness of thin coatings on multi-layer circuit boards. The multi-layer copper plating on this circuit board is usually separated by insulation such as epoxy resin. The advantage of SR-SCOPE is that it uses the resistance method to measure without being affected by other layers, so it can accurately determine the thickness of the upper copper layer.

SR-SCOPE ® RMP30-S application

Copper plating on circuit board
ERCU N probe: 0.1-10 µ m and 5-120 µ m
ERCU-D10 probe: 0.1-10 µ m and 5-200 µ m

Main features:

※ Easy to useHandheld device for precise measurement of coating thickness on circuit boards

※The functional principle is based on the 4-point resistance method and complies with DIN EN 14571 standard
※Once the probe is inserted, the measurement will automatically begin
※Provide various probes for small and large measurement areas
※Large LCD displaysAutomatic probe recognition
※Acoustic signals used for measurement and exceeding limitsExternal Monitoring
※Statistical evaluation and storage,Store up to 10000 measurement values and 1000 blocks in up to 100 applications
※The calibration of certified Cu/Iso standards provides traceability of measurement results
※Measurement units switchable between micrometers and mils

※8 display language optionsBidirectional RS232 port for PC or printer connection.

order goodsInformation:

SR-SCOPE RMP30-S 603-714
Standard Supply Scope: Instruments,
Portable case, battery, AC adapter,instructions
Bracket V12 Base 604-420
Clamping device for ERCU probe model 603-658
Support handheld instrument 600-025
Interface Connection Group MP 602-341
Adapter USB-RS232-603-650
Evaluation software FISCHER DataCenter 604-575

Probe ERCU-D10 603-387

Kal-S ERCU Cu/Iso5 μ m (0.2 mil) 603-175
Kal-S ERCU Cu/Iso12 μ m (0.5 mil) 603-176
Kal-S ERCU Cu/Iso18 μ m (0.7 mil) 603-177
Kal-S ERCU Cu/Iso35 μ m (1.4 mil) 603-178
Kal-S ERCU Cu/Iso70 μ m (2.8 mil) 603-179
Kal-S ERCUCu/Iso105 μ m (4.2 mil) 603-180
Kal-S ERCU CU/Iso140 μ m (5.6 mil) 603-668

Technical Parameter
model	SR-SCOPE ® RMP30-S
function	Using the principle of micro resistance to measure the thickness of copper layer
application	Measure the thickness of copper foil layer on multi-layer circuit boards and single/double-sided flexible boards
Host characteristics	Extra LargeLCDdisplay
accuracy	ERCU Nprobe range1：0.1 – 10 μm (0.004 – 0.4 mils) range2：5 – 120 μm (0.2 – 4.mils) ERCU-D10probe range1：0.1 – 10 μm (0.004 – 0.4 mils) range2: 5 – 200 μm (0.2 – 8 mils)
repeatability	ERCU NProbe:0.2 μm (0.008 mils) ≤ s ≤ 2 %reading ERCU-D10：0.075 μm (0.003 mils) ≤ s ≤ 1.5 %reading
Host size	160×80×30（mm）
Weight	230g

Measurement and analysis instruments from Helmut Fischer

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